h thin-film cascadable amplifier 5 to 1000 mhz t echnical data features ? frequency range: 5 to 1000mhz ? high gain: 23.0 db (typ) ? medium output power: +14.0 dbm (typ) ? temperature compensated ? surface mount option applications ? if/rf amplification ? output stage description the 1021 series is a two-stage bipolar rf amplifier built on a thin-film substrate. active bias and resistive feedback provide for stability over temperature and bias voltage variations. input/ output blocking capacitors couple the rf through the amplifier while a low vswr is maintained through the use of inductive tuning. the 1021 series amplifiers are available in three packages: the to-8 hermetic case, the connectored tc-1 package or the surface mount planarpak pp-38. a vantek products uto/utc/ppa 1021 series pin configuration utoto-8u ground case ground v + rf out rf in utctc-1 rf v + in rf out ppapp-38 v + ground rf in rf out weight: (typical) ut o 2.1 grams; ut c 21.5 grams; pp a 0.5 grams schematic maximum ratings parameter maximum dc voltage +17 volts continuous rf input power +13 dbm operating case temperature C55 to +115 c storage temperature C62 to +150 c r series burn-in temperature +115 c 24 gain, db 0 gain frequency, mhz 200 23 400 800 1000 22 rf out rf in 20 600 noise figure, db frequency, mhz noise figure v+ 4 0 200 3 400 800 1000 2 1 600 21 thermal characteristics 1 q jc 105/75 c/w 2 active transistor power dissipation 230/460 mw 2 junction temperature above case temperature 24/34 c 2 mtbf (mil-hdbk-217e, a uf @ 90 c) 575,400 hrs. notes: 1. for further information, see reliability screening, pub. 5963-3240e. 2. values refer to first and second stages, respectively. .com .com .com 4 .com u datasheet
2 electrical specifications (measured in 50 w system @ +15 vdc nominal unless otherwise noted) symbol unit t c = C55 to +85 c 5-1000 21.0 1.0 5.0 +11.0 2.0:1 2.0:1 mhz db db db dbm dbm dbm dbm ma t c = 0 to 50 c guaranteed specifications typical t c = 25 c 5-1000 23.0 0.7 3.8 +14.0 <1.6:1 <1.6:1 +25.0 +30.0 +40.0 85 5-1000 22.0 1.0 4.5 +12.0 2.0:1 2.0:1 characteristic frequency range small signal gain (min.) gain flatness (max.) noise figure (max.) power output @ +1 db comp. (min.) input vswr (max.) output vswr (max.) two tone 3rd order intercept point two tone 2nd order intercept point one tone 2nd harmonic intercept point dc current bw gp nf p 1db ip 3 ip 2 hp 2 i d typical performance over temperature (@ +15 vdc unless otherwise noted) key: +25 c +85 c -55 c 24 gain, db 0 gain frequency, mhz 200 23 400 800 1000 22 rf out rf in 20 600 noise figure, db frequency, mhz noise figure v+ 4 0 200 3 400 800 1000 2 1 600 21 16 power output
@ 1 db gain
compression, dbm power output frequency, mhz 0 vswr input vswr frequency, mhz vswr output vswr frequency, mhz 200 2.0 1.75 1.5 1.25 1.0 0 200 400 600 12 1000 15 400 800 600 800 13 1000 2.0 0 200 600 1.0 1.75 400 800 1.5 1000 1.25 14 30 ip 3 , dbm third-order intercept point frequency, mhz 0 second-order intercept point frequency, mhz second-harmonic intercept point frequency, mhz 200 70 60 50 40 30 0 200 400 600 22 1000 28 400 800 600 800 24 1000 60 0 200 600 20 50 400 800 40 1000 30 26 20 ip 2 , dbm hp 2 , dbm .com .com .com .com 4 .com u datasheet
3 automatic network analyzer measurements frequency vswr gain phase phase group delay vswr isolation mhz in db degrees dev ns out db numerical readings bias = 15.00 volts 100.0 1.23 23.92 C19.76 C1.86 .00 1.46 39.57 200.0 1.29 23.86 C38.37 C.30 .53 1.47 38.06 300.0 1.32 23.81 C58.28 C.05 .55 1.50 38.34 400.0 1.33 23.86 C77.78 .60 .56 1.53 38.86 500.0 1.33 24.06 C97.55 .99 .53 1.57 39.30 600.0 1.33 24.08 C117.37 1.32 .56 1.62 40.29 700.0 1.37 24.08 C137.82 1.02 .58 1.69 41.20 800.0 1.46 23.88 C158.85 .17 .59 1.75 42.65 900.0 1.60 23.79 179.93 C.87 .57 1.80 44.65 1000.0 1.75 23.77 158.44 C2.20 .60 1.80 46.55 1100.0 1.92 23.89 137.08 .63 1.74 47.79 1200.0 2.05 23.50 113.77 .67 1.57 45.26 1300.0 1.94 22.61 89.77 .61 1.41 44.27 1400.0 1.81 21.46 68.99 .55 1.32 43.97 1500.0 1.75 20.55 50.19 .52 1.29 45.01 (typical production unit @ +25 c ambient) linearization range: 100.0 to 1000.0 mhz s-parameters s 21 100.0 .185 146.0 23.784 C18.6 C38.957 6.3 .127 171.9 200.0 .196 121.9 23.853 C36.4 C38.320 C7.7 .130 172.8 300.0 .208 101.8 23.911 C55.6 C38.914 C13.9 .144 166.8 400.0 .217 82.3 24.117 C74.8 C38.946 C21.9 .157 156.7 500.0 .214 60.7 24.500 C94.9 C39.187 C30.0 .174 142.7 600.0 .204 33.0 24.667 C115.4 C40.060 C39.4 .194 126.6 700.0 .203 C1.5 24.741 C137.0 C41.302 C46.9 .214 110.3 800.0 .218 C37.0 24.566 159.8 C43.007 C53.4 .235 54.0 900.0 .249 C67.7 24.335 177.3 C44.784 C54.5 .249 79.7 1000.0 .277 C93.1 24.053 154.6 C47.587 C41.4 .248 65.2 1100.0 .297 C116.5 23.828 132.8 C47.857 C23.1 .227 45.2 1200.0 .299 C143.5 23.064 109.9 C44.830 C21.8 .181 31.5 1300.0 .255 C172.2 21.912 87.4 C43.135 C30.0 .137 18.9 1400.0 .204 158.6 20.568 68.2 C42.697 C40.6 .110 6.5 1500.0 .169 127.2 19.516 50.7 C42.957 C43.3 .108 C9.7 bias = 15.00 volts frequency mhz mag ang db ang db ang mag ang s 11 s 22 s 12 .com .com .com .com 4 .com u datasheet
4 product options uto ?509r screening option blank = no screening
r = r-series screening
for more information on r-series screening,
see reliability screening, pub. 5963-3240e. model number prefix uto-
utm-
ppa- model number utc ?509-1 connector option for tc-1 case the only connector option
available is the -1. the -1 option consists
of a sma female connector on both the
input and output (see note). model number prefix utc- model number note: r-series screening is not available in the tc-1 case as the case is non-hermetic. case drawings to-8u .031 .031 .50
dia .450
dia max .175 .017 0.22
min +.002 - 001 .150
typ .300
typ ground case
ground v .150
typ 3 4 2 1 45 + rf in approximate weight 2.1 grams rf out glass ring
.060 dia typ
(3x) notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010 .com .com .com .com 4 .com u datasheet
5 gnd .350 .890 .460 .310 dc input .38
(2) pl .24 .19 sma jack (female)
(2) pl .180 .640 .905 .095 .250 .570 2-56 unc-2b x .15 deep
threaded insert
(4) pl .460 .310 .350 1.000 .820 product marking
area typical weight with connectors = 21.5 grams
rf .100 v + in rf out notes: 1. the tc-1 case is a non-hermetic case.
2. the only connector option available for the tc-1 case is the ?, sma female connectors at both input and output ports.
agc (if required) .890 .500 notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xx .02 xxx .010 case drawings tc-1 .com .com .com .com 4 .com u datasheet
.375 x .375 planarpak surface mounted components case drawings pp-38 .010 r
(4) plcs. .035r
(4) plcs detail "a" "a" .040
(4) plcs .010
(4) plcs. .015 .006 .004 .150 ?.010 .010 (4) plcs .040 .015 + .002
(4) plcs .030
(3) plcs .375 sq. c l c l .050 ?.010
(8) plcs. 4 3 2 1 note 5 typical weight 0.5 grams pin designation case 1 2 3 4 pp-38 rf in ground rf out v + pp-38m rf lo if n/c pp-38f rf in ground rf out ground notes (unless otherwise specified): 1. dimensions are specified in inches 2. tolerances: xxx .005 3. leads are for testing only and may be trimmed flush at time of installation. 4. n/c = not connected 5. pin 2 is not at ground potential for pp-38m. it looks the same as pins 1, 3, and 4. recommended assembly procedure 1. chemically clean the pc board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. do not use ultrasonic cleaning. 2. mask the backside of the pc board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. a suggested masking material is 2 mil thick kapton? film with silicone adhesive back (permacel part #p-222). 3. apply solder cream (suggest multicore sn62prmab3 or equivalent) using screen printing techniques or careful hand application. a layer 4 to 6 mils thick is adequate. 4. reflow of the unit to the board may be done in many ways. using a hot plate is one of the most simple. during reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. absolute maximum reflow temperature is 260 c for not more than 10 seconds. 5. chemically reclean the unit using the procedures given in step one. make sure that a flux remover is used which is appropriate for the type of solder cream used (multicore pc81 is the recommended flux remover for the above mentioned cream). it should be noted that there are many alternatives for component attachment. this procedure has been found to be simple and effective. for more detailed instructions on how to use planarpak products, please see the application note planarpak users information, pub.5963-3232e. for more information: united state s * europe* far east/australasia: (65) 290-6305 canada: (416) 206-4725 japan: (81 3) 3331-6111 * call your local hp sales office listed in your telephone directory. ask for a components representative. data subject to change copyright ? 1995 hewlett-packard co. printed in u.s.a. 5963-2450e (10/94) h .com .com .com 4 .com u datasheet
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